SEM Lab, Inc. created a video (link below) to illustrate simulation of BGA solder joints during the reflow solder process.  This approach allows us to determine at what height the solder joint becomes unstable and separates into two droplets during reflow.  This simulation tool will be useful for identifying the BGA warpage value that would be expected to cause defects such as head-in-pillow.


Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes:

<a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

The reCAPTCHA verification period has expired. Please reload the page.