SEM Lab, Inc.

SEM Lab, Inc. provides failure analysis and scanning electron microscopy (SEM) services to many branches of manufacturing, such as the electronics, medical, and aerospace industries, where these are vital tools used to determine the root cause of failures in order to keep them from recurring.

SEM Lab, Inc. has  expertise which covers metals, ceramics, polymers, composites, and many more. Our failure analysis lab has performed thousands of root cause analyses and has experience with a wide range of failure modes, materials and processes.  We would be happy to discuss your issue to determine a plan of action.

We have provided many examples of our failure analysis and SEM work as well as an on-going current blog showing some of our most interesting cases. 

EOS Damage

Failure Analysis


Metallurgical analysis


Corrosion problems


Structural failure analysis


Fracture analysis

Solder microstructure

Materials Analysis


Characterization of materials (metals, plastics, ceramics, glasses) 


FTIR (Fourier Transform Infrared Spectroscopy)


Particle analysis and identification


Metallurgical evaluation


Microstructural characterization

Gold Wire Bond

Electronic Component F/A


Device and component failures


Electronic assembly analysis


Component failure mechanisms


PWB construction analysis

Failure analysis of solder joint fatigue

SEM/EDS Analysis


Zoom magnification up to 50,000X


Elemental analysis of C (z=6) to U (z=92)

 

Failure Analysis


SEM Lab, Inc. is a failure analysis lab providing services to many branches of manufacturing, such as the electronics, medical or aerospace industries, where it is vital to determine the root cause of a failure in order to keep it from recurring. At SEM Lab, Inc., we provide:

  • F/A of Electronic Devices
  • F/A of Medical Devices
  • F/A of Ceramics and Plastics
  • Metallurgical F/A

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Materials Analysis


SEM Lab, Inc. performs materials analysis, identification, and characterization of a wide variety of materials and processes. Materials such as metals, plastics, ceramics, glasses, and particles are commonly examined.

  • General Materials Analysis
  • Electronic Materials and Process Analysis

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Electronic Component F/A


SEM Lab, Inc. is a lab that specializes in root cause failure analysis of electronic assemblies, printed-circuit-boards (PCBs), printed-wiring-boards (PWBs), and electronic components such as integrated circuits (ICs), memory chips, transistors, diodes, capacitors, resistors, LEDs, power modules, and many others. We have analyzed electronic devices, components and assemblies for ESD, EOS, shorts, opens, corrosion, solderability, vibration, thermal fatigue, connector failures, etc.

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Failure Analysis Lab

SEM Lab, Inc. provides failure analysis, materials characterization, scanning electron microscopy (SEM) and FTIR services. We specialize in root cause failure analysis of electronic assemblies, printed-circuit-boards (PCBs) or printed-wiring-boards (PWBs), and electronic components such as integrated circuits (ICs), memory chips, transistors, diodes, capacitors, resistors, light emitting diodes (LEDs), power modules, and many others.

Since 1997 we have developed relationships with over 450 client companies including many of the most prominent electronic, medical and high technology companies in the world, as well as independent consultants and small businesses.  We support lean manufacturing.

SEE SEM LAB BLOG FOR CURRENT EXAMPLES

Failure analysis of an SMT device with wetting problem

  • SMT device with wetting problem

Transistor failure analysis

  • Transistor failure

BGA Solder Joint Failure Analysis

  • BGA solder joint failure

Particle residue in relay device

  • Particle residue in relay device.

Pb dendrite

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  • Pb dendrite

Fatigue striations

  • Fatigue striations on a fracture surface