Intermetallics in Solder Joints
Gold embrittlement of solder joints has been written about for at least four decades. Nevertheless, gold embrittlement related solder joint failures represent a significant portion of the work analyzed at SEM Lab, Inc. Gold embrittlement can be avoided by careful solder joint design and knowledge of the causes of this condition. The purpose of this paper is to provide a detailed account of material and process parameters that can lead to gold embrittlement in electronic assemblies.
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