Device and Materials Failure Analysis Examples
Device Examples, Materials Examples, Cross-Section Examples and Miscellaneous Examples
At SEM Lab, Inc. our goal is to identify the root cause failure mechanisms. This involves working with our clients to determine the scope of analysis required to achieve this goal. The failure analysis process may include external visual inspection, photography, electrical measurements of the samples, which is often followed by other techniques (optical, SEM, EDS, FTIR, X-ray, and other measurements) to analyze the material and/or the failure. When the analysis is complete, a comprehensive report is provided to the client.
Scanning Electron Microscopy (SEM) images are often necessary to adequately determine a root cause failure mechanism. Below are some links to examples of samples analyzed at SEM Lab, Inc. They are divided into 4 sections: Devices, Materials, Cross-Sections and Miscellaneous.