SEM Lab, Inc. supports printed wiring board failure analysis and construction analysis.  This presentation documents some of the most common failure causes seen in this laboratory.  These include Hi-Pot failures, lamination failures, inner layer separation, corrosion failures, PTH Cu-plating failures, and conductive anodic filament failures.  These failures can be mitigated to a significant degree by utilizing construction analysis to verify PWB quality.  Construction analysis allows assessment of conductor layer thickness, dielectric layer thickness, PTH copper thickness, layer-to-layer registration, standard via & micro-via quality, PTH fill quality, and drilled-hole quality to name a few critical feature attributes. Download >>>  Failure Analysis of PWBs

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