Device Failure Examples
Examples of device failure analysis such as in capacitors, resistors, diodes, ICs, as well as manufacturing defects in devices, and solder joint issues.
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Hot air solder leveled PWB shows exposed Cu-Sn intermetallic compound. This caused severe wetting problems during assembly.
This is a flex crack in MLCC caused by breakout of PCBA from panel. The PCBA layout during the design phase is critical in preventing this type of failure.
Failure analysis of a PCB showing a parallel section of an inner layer. A crack propagated through these copper traces.
Transistor failure caused by electrical overstress damage across most of the emitter region of the die.
LED microsection where the open circuit failure was caused by the die and lens material separating from the bottom of the cup and rupturing the die attachment.
This crystal growth is the result of electro-chemical-migration (ECM) of the solder finish on the IC leads.
This is a chemically decapsulated SMD diode that failed due to excessive current electrical overstress (EOS). The bond wire fuses open near the center of the span because it is heat-sunk at both ends.