Materials Examples
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A solderability issue in a flex circuit. Surface shows oxidized intermetallic compound.
Explosively bonded aluminum-steel material. (Sample courtesy of High Energy Metals, Sequim, WA)
BGA failure due to organic particles on solder bumps. These were also found included in solder joints on finished assemblies.
Using SEM analysis to determine that the contaminant on a paper product is potassium chloride.
Pb-dendrite formed by electromigration on the surface of the flux residue.
Fatigue striations on the fracture surface of a stainless steel spring.
Corrosion problem causing gold plating to flake off.
Ball Grid Array (BGA) solder joint failure analysis.
SEM image of a ceramic sample.
Dielectric void in base metal electrode (BME).
HDI micro-via quality evaluation.
SEM image of cashmere with measurement.