Electronic Component Failure Analysis
Electronic Component Failure Analysis of PCBs, PWBs, ICs, Chips, Transistors, Diodes, Capacitors, Resistors, LEDs, Power Modules, etc.
SEM Lab, Inc. is a failure analysis lab that specializes in electronic component failure analysis of assemblies, printed-circuit-boards (PCBs), printed-wiring-boards (PWBs), and electronic components such as integrated circuits (ICs), memory chips, transistors, diodes, capacitors, resistors, LEDs, power modules, and many others. We have analyzed electronic devices, components and assemblies for ESD, EOS, shorts, opens, corrosion, solderability, vibration, thermal fatigue, connector failures, etc.
Failure Analysis of electronic components usually involves cross-sectioning and examination in the scanning electron microscope to provide accurate root cause failure analysis. The focus of the analysis is primarily on the quality of construction techniques used during the manufacture of these devices.
Some examples of device failure analysis can be found on our Device Examples page.
An excellent source of current and up-to-date examples of electronic component failure analysis can be found on our blog page. Comments and input are appreciated.
Component Failure Analysis
Device Failure Analysis
Failure analysis of electronic components can result in failure mechanisms that are different for every device or assembly. A more detailed look into the failures tailored to specific devices can be found here:
- Identifying Counterfeit Components
- Medical Device Failure Analysis
Device Failure Analysis Documentation
Failure Analysis of Capacitors, Resistors, Inductors, Diodes, Transformers, LEDs, ICs, PWBs, BGAs, PCBAs
SEM Lab, Inc. has created some in-depth documentation of failure mechanisms we have seen in the last 22 years doing electronic component failure analysis. This includes Intermetallics in Solder Joints, Failure Analysis of LEDs , Failure Analysis of BGAs, Gold Embrittlement of Solder Joints, Failure Analysis of PCBAs, Diffusion Barrier Plating in Electronics, Images of Failures in Microelectronic Packaging, Fourier Transform Infrared Analysis, and Failure Analysis of Aluminum Electrolytic Capacitors.
Within these documents SEM Lab, Inc. describes analyzing components for failure mechanisms such as generalized corrosion, bond pad corrosion, gold embrittlement, black pad syndrome (ENIG finished PWBs), plated-through-hole and via failures, electrical contact problems, wire bonds, BGAs, delamination, and electromigration. On-going current examples can also be found on our blog page.
Electrical overstress (EOS) damage on metallization run on Op-Amp.
LED Die Fracture
Transistor failure caused by electrical overstress damage across most of the emitter region of the die.
Capacitor failure caused by a crack running through several opposing capacitor plates.