A client provided two sensor assemblies for failure analysis of capacitor C4 on the internal PCBA.

MLCC Bending Fracture _1

This is an optical micrograph of the capacitor as mounted on the PCBA.

MLCC Bending Fracture _2

This is an optical image of an intermediate grinding stage during microsection preparation. A bending fracture was noted under one of the terminations.

MLCC Bending Fracture _3

This is a BSE SEM image of the capacitor microsection.

MLCC Bending Fracture _4

The fracture appeared to be due to flexure of the PCBA.

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