Techniques for Analyzing Solder Joints


SEM Lab, Inc. has extensive expertise in evaluation and failure analysis of solder joints.  This presentation highlights some of these capabilities.  These capabilities  include metallurgical cross-sectioning, SEM/EDS analysis, failure analysis, and computational metallurgical analysis.  The analysis results are essential for credible design, process, and product failure analysis.

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Thick film resistor solder joint that failed in brittle fracture mode at the interface between the solder and the Ni-barrier plating
Thick Film Resistor Solder Joint