Sometimes IC bond pad corrosion is caused by residual process chemistry from the die fabrication or packaging process as was the case in this example.

Screen Shot 2016-08-18 at 9.37.10 AM

The decapsulated IC showed corroded aluminum bond pads.

Screen Shot 2016-08-18 at 9.38.15 AM

EDS results showed a clear chlorine peak associated with the corrosion.

The corrosion caused signals to open circuit resulting in device failure.

Check out SEM Lab, Inc.  to learn more.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes:

<a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

The reCAPTCHA verification period has expired. Please reload the page.