Sometimes IC bond pad corrosion is caused by residual process chemistry from the die fabrication or packaging process as was the case in this example.

Screen Shot 2016-08-18 at 9.37.10 AM

The decapsulated IC showed corroded aluminum bond pads.

Screen Shot 2016-08-18 at 9.38.15 AM

EDS results showed a clear chlorine peak associated with the corrosion.

The corrosion caused signals to open circuit resulting in device failure.

Check out SEM Lab, Inc.  to learn more.

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