Miscellaneous Examples
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![This is a plated thru hole (PTH) solder joint where the land on the solder side of the board has lifted due to a combination of excessive z-axis expansion of the laminate during wave solder and shrinkage stress in the solder fillet on cool down. This is a plated thru hole (PTH) solder joint where the land on the solder side of the board has lifted due to a combination of excessive z-axis expansion of the laminate during wave solder and shrinkage stress in the solder fillet on cool down.](https://www.semlab.com/wp-content/gallery/miscellaneous-examples/cache/Example36.gif-nggid03130-ngg0dyn-300x300x100-00f0w010c010r110f110r010t010.gif)
Plated thru hole (PTH) solder joint where the land on the solder side of the board has lifted due to a combination of excessive z-axis expansion of the laminate during wave solder and shrinkage stress in the solder fillet on cool down.
![Gold embrittlement of a solder joint. The digitally enhanced "red" pixels correspond to AuSn4 intermetallic compound, lighter areas are Pb, and darker grey is Sn. Gold embrittlement of a solder joint. The digitally enhanced "red" pixels correspond to AuSn4 intermetallic compound, lighter areas are Pb, and darker grey is Sn.](https://www.semlab.com/wp-content/gallery/miscellaneous-examples/cache/Example35.jpg-nggid03131-ngg0dyn-300x300x100-00f0w010c010r110f110r010t010.jpg)
Gold embrittlement of a solder joint. The digitally enhanced "red" pixels correspond to AuSn4 intermetallic compound, lighter areas are Pb, and darker grey is Sn.