SEM Lab, Inc. supports printed wiring board failure analysis and construction analysis. This presentation documents some of the most common failure causes seen in this laboratory. These include Hi-Pot failures, lamination failures, inner layer separation, corrosion failures, PTH Cu-plating failures, and conductive anodic filament failures. These failures can be mitigated to a significant degree by utilizing construction analysis to verify PWB quality. Construction analysis allows assessment of conductor layer thickness, dielectric layer thickness, PTH copper thickness, layer-to-layer registration, standard via & micro-via quality, PTH fill quality, and drilled-hole quality to name a few critical feature attributes. Download >>> Failure Analysis of PWBs