Pad lift can be caused by excessive heat during reflow soldering or poor copper adhesion to the PWB laminate.
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This is an LED microsection where the open circuit failure was caused by the die and lens material separating from the bottom of the cup and rupturing the die attachment.
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This is a flex crack in MLCC caused by breakout of PCBA from panel. The PCBA layout during the design phase is critical in preventing this type of failure.
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