Provide analytical and engineering support in product development, materials and processes, and failure analysis for high technology companies.


Vice President, SEM Lab, Inc., Snohomish, WA (Dec. 1997 to Present):

Operation of small business providing Scanning Electron Microscopy and Failure Analysis services.

Senior Quality Engineer, Intermec Corp., Everett, WA (Apr. 1996 to Nov. 1997):

Senior Quality Engineer in Product Assurance Organization responsible for root cause failure analysis of dead-on-arrival (DOA) product. Supervises staff of four failure analysis technicians and five product quality auditors. Performs failure investigations and develops technical recommendations for corrective action. Analyzes extensive product failure database to identify new failure trends. Publishes corporate DOA monthly report identifying failure rate by product model. Develops new failure analysis methods and techniques.

Principal Materials and Processes Engineer, Alliant Techsystems Inc., Mukilteo, WA (Feb. 1989 to Mar. 1996):

Lead Engineer in Product Analysis Laboratory performing failure analysis, SEM/EDS analysis, construction analysis, non-destructive testing, manufacturing problem solving, material support, and product development support for OEM electronic and electro-acoustic products. Strong problem solving skills including failure mode identification, physics of failure description, and corrective action. Peformed more than 900 analysis tasks on integrated circuits, hybrid circuits, discrete components, magnetics, fine pitch surface mount technology, through-hole technology, printed wiring boards, thick-film ceramic, mechanical components, and injection molded plastic parts. Developed a unique automated computer controlled power cycling test system for reliability testing and supplier control for printed wiring boards. Resident expert in soldering technology including reliability prediction, solder mechanical behavior, solder joint design and soldering process improvement. Provide failure analysis and consulting services for a variety of local manufacturing companies.

Senior Materials and Processes Engineer, Honeywell Marine Systems, Mukilteo, WA (Oct. 1987 to Feb. 1989):

Developed high density (284 I/O, 11-mil pitch) electronic module assembly processes including lead form and excise, lead tinning, component placement and solder reflow. Applied Design of Experiments and Statistical Process Control techniques to improve process yields. Received Honeywell?s “Technical Achievement Award” for development of unique computer controlled assembly machines including a semi-automatic fine pitch placement system, a fully automatic fine pitch tinning system, and a focused infrared connector soldering system. Performed feasibility investigation for implementation of Vanzetti Solder Inspection System on surface mount electronic modules.

Senior Specialist Engineer, Boeing Electronics Company, Seattle, WA.(Nov. 1986 to Oct. 1987):

Developed fine pitch surface mount assembly processes including screen printing and reflow soldering. Utilized thermal shock testing, high temperature storage tests, cleanliness tests and solderability tests for process analysis and validation. Team leader for the implementation of the “Life Test Program” which provided life test parameters and analytical models for improving designs and predicting performance of soldered assemblies.

Electronic Packaging Engineer, Honeywell Marine Systems, Seattle, WA(Sep. 1984 to Nov. 1986):

Worked in advanced electronic packaging design group developing surface mount electronic assemblies for high reliability applications. Used Computer Vision CADDS4X work stations to develop and document designs. Supported electronic packaging material selection and trade off evaluations. Developed injection molded low insertion force pin grid array socket. Performed an in-depth Surface Mount Technology – Rework and Repair Technology study.

Teacher’s Assistant, University of Washington, Seattle, WA (Sep. 1983 to Sep. 1984):

Graded course work, developed examinations, and instructed quiz sections and laboratory courses in the Material Science and Engineering Department.

Project Engineer, Northwest Technical Industries, Sequim, WA (May 1979 to Sep. 1983):

Performed R & D and manufacturing engineering roles for explosive metal fabrication operations. Experienced in explosives technology, metal fabrication processes, and acoustic properties of materials.


1994 Ph.D. Materials Science and Engineering, University of Washington, Seattle, WA

1986 MS Metallurgical Engineering, University of Washington, Seattle, WA

1983 BS Metallurgical Engineering, University of Washington, Seattle, WA


1993 Surface Mount Technology Association

1984 International Society of Hybrid Microelectronics

1980 ASM International (formerly American Metals Society)

REFERENCES – available on request