Edward W. Hare, Ph.D., SEM Lab, Inc. – Papers and Technical Presentations

  1. 2007 Failure Analysis of BGAs, Ed Hare Ph.D.

  2. 2007 Diffusion Barrier Plating in Electronics, Ed Hare Ph.D.

  3. 2004 Failure Analysis of LEDs, Ed Hare Ph.D.

  4. 2004 Gold Embrittlement of Solder Joints, Ed Hare Ph.D.

  5. 2004 Images of Failures in Microelectronics Packaging, IMAPS NW Chapter – Technical Seminar, February 11, 2004.

  6. 2000 “Applications of Scanning Electron Microscopy (SEM) and Energy Dispersive Spectroscopy (EDS) in Failure Analysis in Electronics Manufacturing”, SAMPE NW Chapter meeting, September 26, 2000.

  7. 1996 “Thermosonic Bonding as an Alternative to Soldering Fine Pitch”, SMTA NW Chapter Meeting, January 18, 1996.

  8. 1995 “Stress Relaxation Behavior of Eutectic Tin-Lead Solder”, Journal of Electronic Materials, October 1995.

  9. 1994 “Stress Relaxation Behavior of Eutectic Tin-Lead Solder with Silver and Copper Additions”, Ph.D. Dissertation, University of Washington, 1994.

  10. 1993 “The Effect of Ag Additions on the Stress Relaxation Behavior of Eutectic Tin-Lead Solder”, TMS Annual Meeting, Denver, CO, 1993.

  11. 1990 “Electrical Resistivity-Constitution Relationships in Ti-Fe and Ti-Ni Alloys”, Journal of Materials Science: Materials in Electronics, Vol. 1, 1990, pp 25-29.

  12. 1989 “Solders and Soldering in the Electronics Industry”, International Society of Hybrid Microelectronics – Student Chapter Meeting, University of Washington.

  13. 1988 “Creep Rupture Failure of Solder Joints”, Microelectronics Interconnect Conference – International Society of Hybrid Microelectronics, Bellingham, WA.

  14. 1987 “11-mil Pitch Assembly Processes for High Density Electronic Modules”, International Society of Hybrid Microelectronics – NW Chapter Meeting, Vancouver, BC.

  15. 1986 “Structure and Property Changes During Room Temperature Aging of Bismuth Solders”, Electronic Packaging: Materials and Processes, ASM Press, 1986, pp. 109-115.