Evaluating Assemblies Using X-Ray
X-Ray inspection is an important tool in evaluating PCB assemblies when external examination is not able to give access to hidden solder joints or internal component details. Often it is used as a first step in failure analysis.
This is a solder fill problem detected by xray imaging on connector solder joints.
Xray side view of diode provides detail for subsequent destructive analysis.
Xray image of IC shows that bond wires are intact.