SEM Lab, Inc. Document Collection
This page is a collection of documents and presentations that we have created based on failure mechanisms we have seen in the last 25 years. Please feel free to download the pdf files. Comments are appreciated ( firstname.lastname@example.org ).
In Part 1, we mentioned that some of the constituents (e.g. Si, Ba, S) found in the EDS spectra of solder flux residue on a PCBA surface are likely due to the solder mask beneath the residue as the e-beam can penetrate through thin residue layers. Here we examine how to analyze EDS data to remove the contribution of the solder mask.