Solder Flux Residue
Solder flux residue left on printed circuit board assemblies often results in corrosion, electro-chemical migration, electrical leakage, and short circuit faults. SEM/EDS analysis of these residues has shown us that various flux chemistries and levels of corrosion can lead to a variety of elemental signatures. This paper investigates what conclusions can be drawn from the EDS data for solder flux residue.
