Failure Analysis and Scanning Electron Microscopy
Toggle navigation
SEM Lab, Inc.
Services
Failure Analysis
Electronic Component Failure Analysis
F/A of Capacitors
Film Capacitors
F/A of Resistors
Chip Resistor Corrosion
F/A of Inductors
F/A of Diodes
F/A of Transformers
F/A of LEDs
F/A of ICs
F/A of PWBs
F/A of BGAs
F/A of PCBAs
F/A of Medical Devices
Identifying Counterfeit Parts
PWB Construction Analysis
X-Ray Inspection
FTIR Analysis
FTIR of Plastic Parts
Scanning Electron Microscopy
Microscopy
EDS Analysis
Thin Film Thickness Measurements
EDS Analysis of Polymers
EDS Analysis of Alloy Plating
Materials Analysis
Solder Joint Analysis
Modeling BGA Solder Joints
BGA Assembly Verification
EDS Data from Sn-Pb Standards
Lead Free Solder Analysis
Particle Analysis
Fiber Analysis
Quality Control
ENIG Quality Control
Examples
Devices
Materials
Cross Sections
Miscellaneous
Request for Quote
Papers
Intermetallics in Solder Joints
Failure Analysis of BGAs
Failure Analysis of LEDs
Gold Embrittlement of Solder Joints
Failure Analysis of PCBAs
Diffusion Barrier Plating in Electronics
FTIR Analysis
Images of Failures in Microelectronics Packaging
Failure Analysis of Aluminum Electrolytic Capacitors
Solder Joint Analysis
BGA Assembly Verification
HASL Finish on PWBs
PWB Failure Analysis
Solder Flux Residue – Part 1
Solder Flux Residue – Part 2
Blog
Links
Contact Us
Facebook
Twitter
Google Plus
LinkedIn
Youtube
BGA Failure
Ball Grid Array (BGA) solder joint failure analysis.
