Failure Analysis and Scanning Electron Microscopy

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    • Failure Analysis
    • Electronic Component Failure Analysis
      • F/A of Capacitors
        • Film Capacitors
      • F/A of Resistors
        • Chip Resistor Corrosion
      • F/A of Inductors
      • F/A of Diodes
      • F/A of Transformers
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      • F/A of BGAs
      • F/A of PCBAs
    • PWB Construction Analysis
    • Medical Device Analysis
    • Identifying Counterfeit Parts
    • Materials Analysis
      • Solder Joint Analysis
        • BGA Assembly Verification
        • EDS Data from Sn-Pb Standards
        • Lead Free Solder Analysis
      • Particle Analysis
      • Fiber Analysis
    • EDS Analysis
      • Thin Film Thickness Measurements
      • EDS Analysis of Polymers
      • EDS Analysis of Alloy Plating
    • FTIR Analysis
      • FTIR of Plastic Parts
    • Scanning Electron Microscopy
    • X-Ray Inspection
    • Microscopy
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      • ENIG Quality Control
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    • Intermetallics in Solder Joints
    • Failure Analysis of BGAs
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    • Failure Analysis of PCBAs
    • Diffusion Barrier Plating in Electronics
    • FTIR Analysis
    • Images of Failures in Microelectronics Packaging
    • Failure Analysis of Aluminum Electrolytic Capacitors
    • Solder Joint Analysis
    • BGA Assembly Verification
    • HASL Finish on PWBs
    • PWB Failure Analysis
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BGA Failure

BGA failure

Ball Grid Array (BGA) solder joint failure analysis.

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