Migration

Dendritic Electromigration

A classic Sn-Pb dendritic growth image that is a clear example of the difference between electrically meaningful conductive growth and incidental residue.

Scale 1704X
Observed feature Classic tin-lead dendritic growth associated with electromigration
Likely mechanism Sn-Pb electromigration causing conductive growth between adjacent signals
Dendritic electromigration example

Interpretation

Why this image matters

The dendritic morphology is visually clear, which makes the image a reference for training engineers to recognize conductive growth rather than treating all surface residue as equivalent.

The report context confirmed Sn-Pb electromigration between several pins and also noted associated corrosion product with chlorine and bromine, supporting a contamination-enabled migration mechanism.

That makes this image a strong reference for explaining how contamination, leakage, corrosion product, and eventual shorting can fit into the same progression.

electromigration dendrites sn-pb shorting
Use this when

Best comparison value

  • Reference: contamination-assisted leakage progression
  • Comparing dendrites with harmless residue
  • Discussing migration-driven shorting between signals