SLSEM LabRemote consulting and member knowledge library
SEM Lab, Inc.
Local workstation processing of PWB cross-section images.

TOOL_3

Stacked-Via Analysis

Upload an SEM or optical cross-section for preliminary computer-vision screening of copper-filled stacked microvias, capture-pad bands, taper, image-plane alignment, and enclosed dark areas.

Submit imagePTH measurement

Secure Intake

Submit one stacked-via cross-section

The website stores the upload privately. Validation, analysis, overlays, artifacts, and the report run on SEM Lab's local workstation.

Pay to unlock TOOL_3One $20 payment unlocks one image-analysis job.

NO REFUNDS. Review the input requirements and Terms before purchasing.

TOOL_3 job

JPG/JPEG/PNG/TIF/TIFF only; maximum 10 MiB and 100 megapixels.

Calibration and QC: Without defensible calibration, physical dimensions are omitted. Enclosed dark areas may be polishing texture or threshold artifacts; center offset is image-plane alignment only.

Interpretation Limits

Review every colored via box, pad band, mask, and warning.

This screening does not establish IPC compliance, product acceptance, electrical performance, reliability, or root cause. Possible voids and offsets require engineering review against the source image and preparation quality.

Evidence handling

The website receives and stores the upload privately; processing and report generation take place on SEM Lab's local workstation. Case evidence and reports are retained indefinitely. See the Privacy policy for handling and retention, and the Terms before purchasing.