Failure Analysis of Diodes

Diode Failures

The failure analysis of diodes usually involves variety of causes including electrical over-stress, electro-static discharge, die attachment porosity, other manufacturing defects.

Failures in diodes and a diode microsection are shown below.

 

ELECTRONIC COMPONENT F/A

FAILURE ANALYSIS SERVICES

Other device failure analysis information:


Diodes

Decapsulated diode.

Decapsulated diode.

Shorted diode in cross section.

SEM image of a shorted diode in cross-section. There are voids in all of the solder layers in the stack, indicated by the arrows..

Diode Melt Through

The diode melt-through is visible in the top-right corner of the die.