BGA Failure Analysis 

 Ball Grid Array (BGA) Failure Analysis

 

The high density of I/O pins in Ball Grid Array (BGA) devices  is what makes them desirable but it is also what makes BGA failure analysis task so complex.  Most BGA failures examined at SEM Lab, Inc. have been related to warpage issues, black-pad-syndrome, brittle interfacial fracture, and assembly level process issues.

SEM images of a BGA cross-section and failures seen in Ball Grid Arrays (BGAs) are shown below.

ELECTRONIC COMPONENT F/A

FAILURE ANALYSIS SERVICES

 

 

Other device failure analysis information:


bga Failure Analysis

BGA joint microsection.

Brittle interfacial fracture.

Brittle interfacial fracture.

Solder ball composition.