BGA Failure Analysis
Ball Grid Array (BGA) Failure Analysis
The high density of I/O pins in Ball Grid Array (BGA) devices is what makes them desirable but it is also what makes BGA failure analysis task so complex. Most BGA failures examined at SEM Lab, Inc. have been related to warpage issues, black-pad-syndrome, brittle interfacial fracture, and assembly level process issues.
SEM images of a BGA cross-section and failures seen in Ball Grid Arrays (BGAs) are shown below.