SEM Lab, Inc.
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Free 10-page sample report

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Solder-Flux-Associated Failures in Electronic Assemblies demonstrates how SEM Lab connects electrical behavior, failure-site location, microscopy, elemental chemistry, process history, and evidence limits in a clear written deliverable.

This public paper is a composite technical example built from anonymized SEM Lab evidence. A client report is tailored to the submitted hardware, question, and available evidence.

Cover of the sample report Solder-Flux-Associated Failures in Electronic Assemblies

What the sample demonstrates

A report is an evidence argument, not an image collection.

The value is in connecting observations to the reported symptom, testing competing explanations, and stating the conclusion at the level the evidence supports.

Answer first

Decision-oriented findings

Key findings appear before the detailed discussion so engineers and managers can quickly understand the mechanism, limits, and practical significance.

Traceable evidence

Images tied to analytical sites

Micrographs, EDS sites, spectra, electrical behavior, and process history remain linked so the reader can follow how each conclusion was reached.

Calibrated language

Evidence limits stated plainly

The report separates what was observed from what it means, identifies alternative sources, and avoids turning a residue or elemental peak into unsupported proof.

Sample report page with SEM images, an EDS spectrum, a technical caption, and discussion of moisture-sensitive leakage
A representative evidence page keeps the failure-site image, analytical result, caption, and interpretation together.

Inside the report

Six cases, one physical failure chain

The sample follows retained residue through different endpoints rather than treating each symptom as an unrelated category.

  • Chloride-assisted copper and silver corrosion
  • Moisture-sensitive electrical leakage
  • Residue retained beneath low-access components
  • Sequential flux-process incompatibility
  • Permanent electrochemical-migration paths
  • Flux entrapment compounding a plating defect

The report then converts those findings into a practical analysis sequence and manufacturing-process controls.

Engineering usefulness

From laboratory evidence to corrective action

Strong failure analysis does more than name a contaminant. It identifies the conditions that complete the mechanism and the process controls that can interrupt it upstream.

  • Preserve and localize the original electrical symptom.
  • Use SEM and EDS at the relevant failure site.
  • Compare failed, control, washed, and unwashed conditions.
  • Qualify the complete material, cleaning, drying, and coating sequence.
  • Verify corrective action under the condition that produced the symptom.
Sample report page explaining evidence limits, the failure-analysis sequence, process controls, and conclusions
The final sections translate the evidence into an analysis sequence, process controls, and bounded conclusions.

Review the example

Download the full report, then decide whether this format fits your technical question.

The public sample is free. A paid review applies the same evidence discipline to the files and question submitted through the SEM Lab intake process.