Evidence coverage
Failure modes
contaminationanalytical interference
Materials
solder flux residuesolder mask
Analytical methods
SEMEDSbackground correction
Public evidence metadata ยท SEM-EVIDENCE-0017
This paper extends the solder-flux-residue topic by examining how to interpret EDS data when the electron beam can penetrate thin residue layers and include contribution from the solder mask underneath. The source page specifically frames the paper around removing that solder-mask contribution from the analysis. That makes Part 2 a useful companion to Part 1 rather than a repeat. It is focused more narrowly on how to interpret the data correctly when residue is present on a PCBA surface.