Evidence coverage
Failure modes
contaminationcorrosionassembly failure
Materials
printed circuit board assembliessolder
Analytical methods
stereomicroscopyelectrical verificationcross-sectioningSEMEDS
Public evidence metadata ยท SEM-EVIDENCE-0006
This paper covers practical failure-analysis approaches for printed circuit board assemblies. The source page outlines a general workflow that includes documentation review, microscope examination, electrical isolation or verification of the failure, cross-sectioning for PWB-related failures, decapsulation or cross-sectioning for component-related failures, and SEM/EDS work to document the failure site and resolve root cause. The page also includes practical "dos and don'ts" intended to improve the timeliness and cost effectiveness of PCBA failure analysis. That makes the paper useful not only as a mechanism reference, but also as a guide to handling, documentation, and pre-analysis discipline.