Public evidence metadata · SEM-EVIDENCE-0005

Failure Analysis of LEDs

This paper covers recurring LED failure modes and the practical failure-analysis approach used to evaluate them. The source page describes intermittent or no-light symptoms, and it notes that LED failures often involve de-bonding of the lens material from the cup or die surface due to thermal-expansion mismatch and thermal stress. The paper also appears to summarize other failure modes seen in SEM Lab LED work, including die attach failure, die cracking, wedge bond failure, and ball bond failure. The overall pattern is that many of these failures are induced by mechanical or thermo-mechanical stresses.