Public evidence metadata · SEM-EVIDENCE-0004

Failure Analysis of BGAs

This paper covers practical approaches for failure analysis of Ball Grid Array devices. The source page describes BGA analysis as difficult because of the high I/O count and packaging density, and it positions the paper as a discussion of several BGA failure modes and analysis approaches that can be performed with a limited number of analytical tools. The paper also appears to distinguish between cases that can be addressed with limited tools such as a DMM, microsectioning, and SEM/EDS, and cases where more advanced work is needed to identify the failure cause.