SEM Lab, Inc. Document Collection

This page is a collection of documents and presentations that we have created based on failure mechanisms we have seen in the last 25 years. Please feel free to download the pdf files. Comments are appreciated ( ). 


Solder flux residue left on printed circuit board assemblies often results in corrosion, electro-chemical migration, electrical leakage, and short circuit faults. SEM/EDS analysis of these residues has shown us that various flux chemistries and levels of corrosion can lead to a variety of elemental signatures. This paper investigates what conclusions can be drawn from the EDS data for solder flux residue.


  • Papers »
  • Solder Flux Residue - Part 1