{"id":22015,"date":"2022-02-03T00:56:52","date_gmt":"2022-02-03T00:56:52","guid":{"rendered":"https:\/\/www.semlab.com\/?p=22015"},"modified":"2024-04-06T20:31:15","modified_gmt":"2024-04-06T20:31:15","slug":"services-materials-analysis-solderjoints-modeling-bga-solder-joints","status":"publish","type":"post","link":"https:\/\/www.semlab.com\/old\/services-materials-analysis-solderjoints-modeling-bga-solder-joints\/","title":{"rendered":"BGA Solder Joint Simulation"},"content":{"rendered":"<div class=\"boldgrid-section\">\n<div class=\"container\">\n<div class=\"row\">\n<div class=\"col-md-12 col-xs-12 col-sm-12 col-lg-12\">\n<p class=\"\">&nbsp;<\/p>\n<p class=\"\">&nbsp;<\/p>\n<p class=\"\"><img loading=\"lazy\" decoding=\"async\" class=\"alignnone size-large wp-image-20121\" src=\"https:\/\/www.semlab.com\/semlab.comold\/2017\/wp-content\/uploads\/2018\/10\/HIP1-1024x550.png\" alt=\"\" width=\"1024\" height=\"550\" srcset=\"https:\/\/www.semlab.com\/wp-content\/uploads\/2018\/10\/HIP1-1024x550.png 1024w, https:\/\/www.semlab.com\/wp-content\/uploads\/2018\/10\/HIP1-600x323.png 600w, https:\/\/www.semlab.com\/wp-content\/uploads\/2018\/10\/HIP1-300x161.png 300w, https:\/\/www.semlab.com\/wp-content\/uploads\/2018\/10\/HIP1-768x413.png 768w, https:\/\/www.semlab.com\/wp-content\/uploads\/2018\/10\/HIP1-250x134.png 250w, https:\/\/www.semlab.com\/wp-content\/uploads\/2018\/10\/HIP1-550x296.png 550w, https:\/\/www.semlab.com\/wp-content\/uploads\/2018\/10\/HIP1-800x430.png 800w, https:\/\/www.semlab.com\/wp-content\/uploads\/2018\/10\/HIP1-335x180.png 335w, https:\/\/www.semlab.com\/wp-content\/uploads\/2018\/10\/HIP1-558x300.png 558w, https:\/\/www.semlab.com\/wp-content\/uploads\/2018\/10\/HIP1-930x500.png 930w, https:\/\/www.semlab.com\/wp-content\/uploads\/2018\/10\/HIP1.png 1332w\" sizes=\"auto, (max-width: 1024px) 100vw, 1024px\" \/><\/p>\n<p class=\"\">SEM Lab, Inc. created a video (link below) to illustrate simulation of BGA solder joints during the reflow solder process. &nbsp;This approach allows us to determine at what height the solder joint becomes unstable and separates into two droplets during reflow. &nbsp;This simulation tool will be useful for identifying the BGA warpage value that would be expected to cause defects such as head-in-pillow.<\/p>\n<p class=\"\">&nbsp;<\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<div class=\"boldgrid-section\">\n<div class=\"container\" style=\"text-align: center;\">\n<p class=\"mod-reset\"><a class=\"\" href=\"https:\/\/www.semlab.com\/services\/materials-analysis\/solderjoints\/modeling-bga-solder-joints\/\" target=\"_blank\" rel=\"noopener\">Modeling BGA Solder Joints<\/a><\/p>\n<\/div>\n<\/div>\n<div class=\"boldgrid-section\">\n<div class=\"container\"><\/div>\n<\/div>\n","protected":false},"excerpt":{"rendered":"<p>&nbsp; &nbsp; SEM Lab, Inc. created a video (link below) to illustrate simulation of BGA solder joints during the reflow solder process. &nbsp;This approach allows us to determine at what height the solder joint becomes unstable and separates into two droplets during reflow. &nbsp;This simulation tool will be useful for identifying the BGA warpage value [&hellip;]<\/p>\n","protected":false},"author":2,"featured_media":0,"comment_status":"open","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"_mo_disable_npp":"no","ngg_post_thumbnail":0,"footnotes":""},"categories":[1],"tags":[],"class_list":["post-22015","post","type-post","status-publish","format-standard","hentry","category-uncategorized"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v26.9 - 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