{"id":18770,"date":"2017-09-01T17:06:39","date_gmt":"2017-09-01T17:06:39","guid":{"rendered":"http:\/\/semlab.com\/?page_id=18770"},"modified":"2024-04-04T02:13:47","modified_gmt":"2024-04-04T02:13:47","slug":"fa-of-ics","status":"publish","type":"page","link":"https:\/\/www.semlab.com\/old\/services\/electronic-component-failure-analysis\/fa-of-ics\/","title":{"rendered":"F\/A of ICs"},"content":{"rendered":"<div class=\"boldgrid-section\">\n<div class=\"container\">\n<div class=\"row\" style=\"padding-bottom: 50px; padding-top: 0px;\">\n<div class=\"col-md-9 col-sm-8 col-xs-9\">\n<p class=\"mod-reset\"><img class=\"bg-img\" data-width=\"458\" data-height=\"265\"><\/p>\n<h2 class=\"\" style=\"text-align: center;\">Failure Analysis of ICs<\/h2>\n<h4 class=\"\" style=\"text-align: center;\">Integrated Circuits (ICs)<\/h4>\n<p>&nbsp;<\/p>\n<p class=\"\">Failure analysis of ICs typically involves external examination, continuity testing, chemical decapsulation, and SEM\/EDS analysis of the device die.<\/p>\n<p class=\"\">SEM images of failures in integrated circuits (ICs) and a decapsulated IC are shown below.<\/p>\n<p class=\"\">\n<style type=\"text\/css\">\n<!--\n\n.prisna-gwt-align-left {\n\ttext-align: left !important;\n}\n.prisna-gwt-align-right {\n\ttext-align: right !important;\n}\n\n\n\nbody {\n\ttop: 0 !important;\n}\n.goog-te-banner-frame {\n\tdisplay: none !important;\n\tvisibility: hidden !important;\n}\n\n#goog-gt-tt,\n.goog-tooltip,\n.goog-tooltip:hover {\n\tdisplay: none !important;\n}\n.goog-text-highlight {\n\tbackground-color: transparent !important;\n\tborder: none !important;\n\tbox-shadow: none !important;\n}\n.translated-rtl font,\n.translated-ltr font {\n\tbackground-color: transparent !important;\n\tbox-shadow: none !important;\n\tbox-sizing: border-box !important;\n\t-webkit-box-sizing: border-box !important;\n\t-moz-box-sizing: border-box !important;\n}\n\n-->\n<\/style>\n\n\n\n<div id=\"google_translate_element\" class=\"prisna-gwt-align-left\"><\/div>\n<script type=\"text\/javascript\">\n\/*<![CDATA[*\/\nfunction initializeGoogleTranslateElement() {\n\tnew google.translate.TranslateElement({\n\t\tpageLanguage: \"en\"\n\t}, \"google_translate_element\");\n}\n\/*]]>*\/\n<\/script>\n<script type=\"text\/javascript\" src=\"\/\/translate.google.com\/translate_a\/element.js?cb=initializeGoogleTranslateElement\"><\/script><\/p>\n<p class=\"\" style=\"margin-top: 10px;\"><a class=\"btn-color-1 btn btn-capitalize btn-pill btn-raised btn-regular\" style=\"margin: 10px 0px;\" href=\"https:\/\/www.semlab.com\/services\/electronic-component-failure-analysis\/\">ELECTRONIC COMPONENT F\/A<\/a><\/p>\n<p class=\"\" style=\"margin-top: 10px;\"><a class=\"btn-color-1 btn btn-capitalize btn-pill btn-raised btn-regular\" style=\"margin: 10px 0px;\" href=\"https:\/\/www.semlab.com\/services\/\">FAILURE ANALYSIS SERVICES<\/a><\/p>\n<\/div>\n<div class=\"col-md-3 col-sm-12 col-xs-12\">\n<h4>&nbsp;<\/h4>\n<h4 class=\"color3-color\">Other device failure analysis information:<\/h4>\n<ul class=\"bg-list-share bg-list\">\n<li><a class=\"color1-color\" href=\"https:\/\/www.semlab.com\/services\/electronic-component-failure-analysis\/capacitor-failure-analysis\/\">Capacitors<\/a><\/li>\n<li><a class=\"color1-color\" href=\"https:\/\/www.semlab.com\/services\/electronic-component-failure-analysis\/fa-of-resistors\/\">Resistors<\/a><\/li>\n<li><a class=\"color1-color\" href=\"https:\/\/www.semlab.com\/services\/electronic-component-failure-analysis\/fa-of-inductors\/\">Inductors<\/a><\/li>\n<li><a class=\"color1-color\" href=\"https:\/\/www.semlab.com\/services\/electronic-component-failure-analysis\/fa-of-diodes\/\">Diodes<\/a><\/li>\n<li><a class=\"color1-color\" href=\"https:\/\/www.semlab.com\/services\/electronic-component-failure-analysis\/fa-of-transformers\/\">Transformers<\/a><\/li>\n<li><a class=\"color1-color\" href=\"https:\/\/www.semlab.com\/services\/electronic-component-failure-analysis\/fa-of-leds\/\">LEDs<\/a><\/li>\n<li><a class=\"color1-color\" href=\"https:\/\/www.semlab.com\/services\/electronic-component-failure-analysis\/fa-of-pwbs\/\">PWBs<\/a><\/li>\n<li><a class=\"color1-color\" href=\"https:\/\/www.semlab.com\/services\/electronic-component-failure-analysis\/bga-failure-analysis\/\">BGAs<\/a><\/li>\n<li><a class=\"color1-color\" href=\"https:\/\/www.semlab.com\/services\/electronic-component-failure-analysis\/fa-of-pcbas\/\">PCBAs<\/a><\/li>\n<\/ul>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<div class=\"tmpl-about-5 boldgrid-section dynamic-gridblock background-scroll\" style=\"background-size: cover; background-position: 50% 50%;\">\n<div class=\"container-fluid\">\n<div class=\"row\">\n<div class=\"col-md-12 col-xs-12 col-sm-12\">\n<div class=\"row bg-editor-hr-wrap\">\n<div class=\"col-md-12 col-xs-12 col-sm-12\">\n<hr>\n<\/div>\n<\/div>\n<\/div>\n<div class=\"col-md-12 col-xs-12 col-sm-12\">\n<div class=\"row\"><\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<div class=\"color-neutral-background-color color-neutral-text-contrast bg-background-color tmpl-testimonial-3 boldgrid-section dynamic-gridblock\">\n<div class=\"container\">\n<div class=\"row\" style=\"padding-top: 0px; padding-bottom: 40px;\">\n<div class=\"col-md-12 col-sm-12 col-xs-12 text-center\">\n<p class=\"h2\" style=\"text-transform: uppercase;\">ics<\/p>\n<\/div>\n<\/div>\n<div class=\"row\" style=\"padding-top: 40px; padding-bottom: 60px;\">\n<div class=\"col-md-3 col-sm-6 col-xs-12 text-center\">\n<p class=\"\"><a href=\"https:\/\/www.semlab.com\/ic1big\/\"><img loading=\"lazy\" decoding=\"async\" class=\"bg-img bg-img-square wp-image-18113 \" src=\"https:\/\/www.semlab.com\/wp-content\/uploads\/2017\/08\/ic1big.gif\" alt=\"Decapsulated IC.\" width=\"377\" height=\"292\" data-height=\"200\" data-width=\"200\"><\/a><\/p>\n<div class=\"row\">\n<div class=\"col-md-12 col-sm-12 col-xs-12\">\n<div class=\"bg-box-1 color-neutral-background-color color-neutral-text-contrast bg-background-color bg-box\" style=\"padding: 15px 10px; border-top: 10px solid; margin-bottom: 20px;\">\n<p style=\"font-style: italic; font-size: .9em; margin: 0;\">Decapsulated IC.<\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<div class=\"col-md-3 col-sm-6 col-xs-12 text-center\">\n<p><a href=\"https:\/\/www.semlab.com\/ic2\/\"><img loading=\"lazy\" decoding=\"async\" class=\"bg-img bg-img-square wp-image-18114 \" src=\"https:\/\/www.semlab.com\/wp-content\/uploads\/2017\/08\/ic2.gif\" alt=\"\" width=\"378\" height=\"402\" data-height=\"200\" data-width=\"200\"><\/a><\/p>\n<div class=\"row\">\n<div class=\"col-md-12 col-sm-12 col-xs-12\">\n<div class=\"bg-box-1 color-neutral-background-color color-neutral-text-contrast bg-background-color bg-box\" style=\"padding: 15px 10px; border-top: 10px solid; margin-bottom: 20px;\">\n<p style=\"font-style: italic; font-size: .9em; margin: 0;\">EOS Failure.<\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<div class=\"col-md-3 col-sm-6 col-xs-12 text-center\">\n<p><a href=\"https:\/\/www.semlab.com\/ic3\/\"><img loading=\"lazy\" decoding=\"async\" class=\"bg-img bg-img-square wp-image-18115 \" src=\"https:\/\/www.semlab.com\/wp-content\/uploads\/2017\/08\/ic3.gif\" alt=\"ESD Failure.\" width=\"434\" height=\"428\" data-height=\"200\" data-width=\"200\"><\/a><\/p>\n<div class=\"row\">\n<div class=\"col-md-12 col-sm-12 col-xs-12\">\n<div class=\"bg-box-1 color-neutral-background-color color-neutral-text-contrast bg-background-color bg-box\" style=\"padding: 15px 10px; border-top: 10px solid; margin-bottom: 20px;\">\n<p style=\"font-style: italic; font-size: .9em; margin: 0;\">ESD Failure.<\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<div class=\"col-md-3 col-sm-6 col-xs-12 text-center\">\n<p class=\"\"><a href=\"https:\/\/www.semlab.com\/ic4\/\"><img loading=\"lazy\" decoding=\"async\" class=\"bg-img bg-img-square wp-image-18116 \" src=\"https:\/\/www.semlab.com\/wp-content\/uploads\/2017\/08\/ic4.gif\" alt=\"\" width=\"344\" height=\"342\" data-height=\"200\" data-width=\"200\"><\/a><\/p>\n<div class=\"row\">\n<div class=\"col-md-12 col-sm-12 col-xs-12\">\n<div class=\"bg-box-1 color-neutral-background-color color-neutral-text-contrast bg-background-color bg-box\" style=\"padding: 15px 10px; border-top: 10px solid; margin-bottom: 20px;\">\n<p style=\"font-style: italic; font-size: .9em; margin: 0;\">Bond pad corrosion.<\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<div class=\"row\" style=\"padding-top: 40px; padding-bottom: 60px;\">\n<div class=\"col-md-3 col-sm-6 col-xs-12 text-center\">\n<p><a href=\"https:\/\/www.semlab.com\/ic5\/\"><img loading=\"lazy\" decoding=\"async\" class=\"bg-img bg-img-square wp-image-18117 \" src=\"https:\/\/www.semlab.com\/wp-content\/uploads\/2017\/08\/ic5.gif\" alt=\"\" width=\"498\" height=\"498\" data-height=\"200\" data-width=\"200\" srcset=\"https:\/\/www.semlab.com\/wp-content\/uploads\/2017\/08\/ic5.gif 150w, https:\/\/www.semlab.com\/wp-content\/uploads\/2017\/08\/ic5-100x100.gif 100w\" sizes=\"auto, (max-width: 498px) 100vw, 498px\" \/><\/a><\/p>\n<div class=\"row\">\n<div class=\"col-md-12 col-sm-12 col-xs-12\">\n<div class=\"bg-box-1 color-neutral-background-color color-neutral-text-contrast bg-background-color bg-box\" style=\"padding: 15px 10px; border-top: 10px solid; margin-bottom: 20px;\">\n<p style=\"font-style: italic; font-size: .9em; margin: 0;\">Bond pad corrosion.<\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<div class=\"col-md-3 col-sm-6 col-xs-12 text-center\">\n<p><a href=\"https:\/\/www.semlab.com\/ic6\/\"><img loading=\"lazy\" decoding=\"async\" class=\"bg-img bg-img-square wp-image-18118 \" src=\"https:\/\/www.semlab.com\/wp-content\/uploads\/2017\/08\/ic6.gif\" alt=\"\" width=\"377\" height=\"350\" data-height=\"200\" data-width=\"200\"><\/a><\/p>\n<div class=\"row\">\n<div class=\"col-md-12 col-sm-12 col-xs-12\">\n<div class=\"bg-box-1 color-neutral-background-color color-neutral-text-contrast bg-background-color bg-box\" style=\"padding: 15px 10px; border-top: 10px solid; margin-bottom: 20px;\">\n<p style=\"font-style: italic; font-size: .9em; margin: 0;\">Dendritic growth.<\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<div class=\"col-md-3 col-sm-6 col-xs-12 text-center\">\n<p><a href=\"https:\/\/www.semlab.com\/ic7\/\"><img loading=\"lazy\" decoding=\"async\" class=\"bg-img bg-img-square wp-image-18119 \" src=\"https:\/\/www.semlab.com\/wp-content\/uploads\/2017\/08\/ic7.gif\" alt=\"\" width=\"592\" height=\"596\" data-height=\"200\" data-width=\"200\"><\/a><\/p>\n<div class=\"row\">\n<div class=\"col-md-12 col-sm-12 col-xs-12\">\n<div class=\"bg-box-1 color-neutral-background-color color-neutral-text-contrast bg-background-color bg-box\" style=\"padding: 15px 10px; border-top: 10px solid; margin-bottom: 20px;\">\n<p style=\"font-style: italic; font-size: .9em; margin: 0;\">Lifted ball bond.<\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<div class=\"col-md-3 col-sm-6 col-xs-12 text-center\">\n<p><a href=\"https:\/\/www.semlab.com\/ic8\/\"><img loading=\"lazy\" decoding=\"async\" class=\"bg-img bg-img-square wp-image-18120 \" src=\"https:\/\/www.semlab.com\/wp-content\/uploads\/2017\/08\/ic8.gif\" alt=\"IC\" width=\"360\" height=\"362\" data-height=\"200\" data-width=\"200\"><\/a><\/p>\n<div class=\"row\">\n<div class=\"col-md-12 col-sm-12 col-xs-12\">\n<div class=\"bg-box-1 color-neutral-background-color color-neutral-text-contrast bg-background-color bg-box\" style=\"padding: 15px 10px; border-top: 10px solid; margin-bottom: 20px;\">\n<p style=\"font-style: italic; font-size: .9em; margin: 0;\">EOS failure of MOSFET.<\/p>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n<\/div>\n","protected":false},"excerpt":{"rendered":"<p>Failure Analysis of ICs Integrated Circuits (ICs) &nbsp; Failure analysis of ICs typically involves external examination, continuity testing, chemical decapsulation, and SEM\/EDS analysis of the device die. SEM images of failures in integrated circuits (ICs) and a decapsulated IC are shown below. ELECTRONIC COMPONENT F\/A FAILURE ANALYSIS SERVICES &nbsp; Other device failure analysis information: Capacitors [&hellip;]<\/p>\n","protected":false},"author":1,"featured_media":18113,"parent":18455,"menu_order":7,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_mo_disable_npp":"","ngg_post_thumbnail":0,"footnotes":""},"class_list":["post-18770","page","type-page","status-publish","has-post-thumbnail"],"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v26.9 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Failure Analysis of ICs - SEM Lab Inc.<\/title>\n<meta name=\"description\" content=\"Failure analysis of ICs typically involves external examination, continuity testing, chemical decapsulation, and SEM\/EDS analysis of the device die.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.semlab.com\/old\/services\/electronic-component-failure-analysis\/fa-of-ics\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Failure Analysis of ICs - SEM Lab Inc.\" \/>\n<meta property=\"og:description\" content=\"Failure analysis of ICs typically involves external examination, continuity testing, chemical decapsulation, and SEM\/EDS analysis of the device die.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.semlab.com\/old\/services\/electronic-component-failure-analysis\/fa-of-ics\/\" \/>\n<meta property=\"og:site_name\" content=\"SEM Lab Inc.\" \/>\n<meta property=\"article:modified_time\" content=\"2024-04-04T02:13:47+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.semlab.com\/old\/wp-content\/uploads\/2017\/08\/ic1big.gif\" \/>\n\t<meta property=\"og:image:width\" content=\"259\" \/>\n\t<meta property=\"og:image:height\" content=\"200\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/gif\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:label1\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data1\" content=\"3 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\/\/schema.org\",\"@graph\":[{\"@type\":\"WebPage\",\"@id\":\"https:\/\/www.semlab.com\/old\/services\/electronic-component-failure-analysis\/fa-of-ics\/\",\"url\":\"https:\/\/www.semlab.com\/old\/services\/electronic-component-failure-analysis\/fa-of-ics\/\",\"name\":\"Failure Analysis of ICs - SEM Lab Inc.\",\"isPartOf\":{\"@id\":\"https:\/\/www.semlab.com\/old\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\/\/www.semlab.com\/old\/services\/electronic-component-failure-analysis\/fa-of-ics\/#primaryimage\"},\"image\":{\"@id\":\"https:\/\/www.semlab.com\/old\/services\/electronic-component-failure-analysis\/fa-of-ics\/#primaryimage\"},\"thumbnailUrl\":\"https:\/\/www.semlab.com\/wp-content\/uploads\/2017\/08\/ic1big.gif\",\"datePublished\":\"2017-09-01T17:06:39+00:00\",\"dateModified\":\"2024-04-04T02:13:47+00:00\",\"description\":\"Failure analysis of ICs typically involves external examination, continuity testing, chemical decapsulation, and SEM\/EDS analysis of the device die.\",\"breadcrumb\":{\"@id\":\"https:\/\/www.semlab.com\/old\/services\/electronic-component-failure-analysis\/fa-of-ics\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\/\/www.semlab.com\/old\/services\/electronic-component-failure-analysis\/fa-of-ics\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\/\/www.semlab.com\/old\/services\/electronic-component-failure-analysis\/fa-of-ics\/#primaryimage\",\"url\":\"https:\/\/www.semlab.com\/wp-content\/uploads\/2017\/08\/ic1big.gif\",\"contentUrl\":\"https:\/\/www.semlab.com\/wp-content\/uploads\/2017\/08\/ic1big.gif\",\"width\":259,\"height\":200,\"caption\":\"Decapsulated IC.\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\/\/www.semlab.com\/old\/services\/electronic-component-failure-analysis\/fa-of-ics\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Home\",\"item\":\"https:\/\/www.semlab.com\/old\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Services\",\"item\":\"https:\/\/www.semlab.com\/old\/services\/\"},{\"@type\":\"ListItem\",\"position\":3,\"name\":\"Electronic Component Failure Analysis\",\"item\":\"https:\/\/www.semlab.com\/old\/services\/electronic-component-failure-analysis\/\"},{\"@type\":\"ListItem\",\"position\":4,\"name\":\"F\/A of ICs\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\/\/www.semlab.com\/old\/#website\",\"url\":\"https:\/\/www.semlab.com\/old\/\",\"name\":\"SEM Lab Inc.\",\"description\":\"Failure Analysis and Scanning Electron Microscopy\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\/\/www.semlab.com\/old\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Failure Analysis of ICs - SEM Lab Inc.","description":"Failure analysis of ICs typically involves external examination, continuity testing, chemical decapsulation, and SEM\/EDS analysis of the device die.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.semlab.com\/old\/services\/electronic-component-failure-analysis\/fa-of-ics\/","og_locale":"en_US","og_type":"article","og_title":"Failure Analysis of ICs - SEM Lab Inc.","og_description":"Failure analysis of ICs typically involves external examination, continuity testing, chemical decapsulation, and SEM\/EDS analysis of the device die.","og_url":"https:\/\/www.semlab.com\/old\/services\/electronic-component-failure-analysis\/fa-of-ics\/","og_site_name":"SEM Lab Inc.","article_modified_time":"2024-04-04T02:13:47+00:00","og_image":[{"width":259,"height":200,"url":"https:\/\/www.semlab.com\/old\/wp-content\/uploads\/2017\/08\/ic1big.gif","type":"image\/gif"}],"twitter_card":"summary_large_image","twitter_misc":{"Est. reading time":"3 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"WebPage","@id":"https:\/\/www.semlab.com\/old\/services\/electronic-component-failure-analysis\/fa-of-ics\/","url":"https:\/\/www.semlab.com\/old\/services\/electronic-component-failure-analysis\/fa-of-ics\/","name":"Failure Analysis of ICs - SEM Lab Inc.","isPartOf":{"@id":"https:\/\/www.semlab.com\/old\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.semlab.com\/old\/services\/electronic-component-failure-analysis\/fa-of-ics\/#primaryimage"},"image":{"@id":"https:\/\/www.semlab.com\/old\/services\/electronic-component-failure-analysis\/fa-of-ics\/#primaryimage"},"thumbnailUrl":"https:\/\/www.semlab.com\/wp-content\/uploads\/2017\/08\/ic1big.gif","datePublished":"2017-09-01T17:06:39+00:00","dateModified":"2024-04-04T02:13:47+00:00","description":"Failure analysis of ICs typically involves external examination, continuity testing, chemical decapsulation, and SEM\/EDS analysis of the device die.","breadcrumb":{"@id":"https:\/\/www.semlab.com\/old\/services\/electronic-component-failure-analysis\/fa-of-ics\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.semlab.com\/old\/services\/electronic-component-failure-analysis\/fa-of-ics\/"]}]},{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/www.semlab.com\/old\/services\/electronic-component-failure-analysis\/fa-of-ics\/#primaryimage","url":"https:\/\/www.semlab.com\/wp-content\/uploads\/2017\/08\/ic1big.gif","contentUrl":"https:\/\/www.semlab.com\/wp-content\/uploads\/2017\/08\/ic1big.gif","width":259,"height":200,"caption":"Decapsulated IC."},{"@type":"BreadcrumbList","@id":"https:\/\/www.semlab.com\/old\/services\/electronic-component-failure-analysis\/fa-of-ics\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Home","item":"https:\/\/www.semlab.com\/old\/"},{"@type":"ListItem","position":2,"name":"Services","item":"https:\/\/www.semlab.com\/old\/services\/"},{"@type":"ListItem","position":3,"name":"Electronic Component Failure Analysis","item":"https:\/\/www.semlab.com\/old\/services\/electronic-component-failure-analysis\/"},{"@type":"ListItem","position":4,"name":"F\/A of ICs"}]},{"@type":"WebSite","@id":"https:\/\/www.semlab.com\/old\/#website","url":"https:\/\/www.semlab.com\/old\/","name":"SEM Lab Inc.","description":"Failure Analysis and Scanning Electron Microscopy","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.semlab.com\/old\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"}]}},"_links":{"self":[{"href":"https:\/\/www.semlab.com\/old\/wp-json\/wp\/v2\/pages\/18770","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.semlab.com\/old\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/www.semlab.com\/old\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/www.semlab.com\/old\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.semlab.com\/old\/wp-json\/wp\/v2\/comments?post=18770"}],"version-history":[{"count":23,"href":"https:\/\/www.semlab.com\/old\/wp-json\/wp\/v2\/pages\/18770\/revisions"}],"predecessor-version":[{"id":22667,"href":"https:\/\/www.semlab.com\/old\/wp-json\/wp\/v2\/pages\/18770\/revisions\/22667"}],"up":[{"embeddable":true,"href":"https:\/\/www.semlab.com\/old\/wp-json\/wp\/v2\/pages\/18455"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.semlab.com\/old\/wp-json\/wp\/v2\/media\/18113"}],"wp:attachment":[{"href":"https:\/\/www.semlab.com\/old\/wp-json\/wp\/v2\/media?parent=18770"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}