1.0SEM Lab Inc.https://www.semlab.com/oldIC Bond Pad Corrosion - SEM Lab Inc.rich600338<blockquote class="wp-embedded-content" data-secret="FmlxQr9Aiq"><a href="https://www.semlab.com/old/ic-bond-pad-corrosion/">IC Bond Pad Corrosion</a></blockquote><iframe sandbox="allow-scripts" security="restricted" src="https://www.semlab.com/old/ic-bond-pad-corrosion/embed/#?secret=FmlxQr9Aiq" width="600" height="338" title="“IC Bond Pad Corrosion” — SEM Lab Inc." data-secret="FmlxQr9Aiq" frameborder="0" marginwidth="0" marginheight="0" scrolling="no" class="wp-embedded-content"></iframe><script type="text/javascript">
/* <![CDATA[ */
/*! This file is auto-generated */
!function(d,l){"use strict";l.querySelector&&d.addEventListener&&"undefined"!=typeof URL&&(d.wp=d.wp||{},d.wp.receiveEmbedMessage||(d.wp.receiveEmbedMessage=function(e){var t=e.data;if((t||t.secret||t.message||t.value)&&!/[^a-zA-Z0-9]/.test(t.secret)){for(var s,r,n,a=l.querySelectorAll('iframe[data-secret="'+t.secret+'"]'),o=l.querySelectorAll('blockquote[data-secret="'+t.secret+'"]'),c=new RegExp("^https?:$","i"),i=0;i<o.length;i++)o[i].style.display="none";for(i=0;i<a.length;i++)s=a[i],e.source===s.contentWindow&&(s.removeAttribute("style"),"height"===t.message?(1e3<(r=parseInt(t.value,10))?r=1e3:~~r<200&&(r=200),s.height=r):"link"===t.message&&(r=new URL(s.getAttribute("src")),n=new URL(t.value),c.test(n.protocol))&&n.host===r.host&&l.activeElement===s&&(d.top.location.href=t.value))}},d.addEventListener("message",d.wp.receiveEmbedMessage,!1),l.addEventListener("DOMContentLoaded",function(){for(var e,t,s=l.querySelectorAll("iframe.wp-embedded-content"),r=0;r<s.length;r++)(t=(e=s[r]).getAttribute("data-secret"))||(t=Math.random().toString(36).substring(2,12),e.src+="#?secret="+t,e.setAttribute("data-secret",t)),e.contentWindow.postMessage({message:"ready",secret:t},"*")},!1)))}(window,document);
//# sourceURL=https://www.semlab.com/wp-includes/js/wp-embed.min.js
/* ]]> */
</script>
Sometimes IC bond pad corrosion is caused by residual process chemistry from the die fabrication or packaging process as was the case in this example. The decapsulated IC showed corroded aluminum bond pads. EDS results showed a clear chlorine peak associated with the corrosion. The corrosion caused signals to open circuit resulting in device failure. […]http://semlab.com/semlab.com/2017/wp-content/uploads/2016/08/Screen-Shot-2016-08-18-at-9.37.10-AM1.png