Delamination
LED Cup De-Bonding
A package-interface separation example showing thermal damage and de-bonding of the lens material at the base of an LED cup.
Interpretation
Why this image matters
This image expands the existing delamination examples by showing a different LED package boundary and a different interpretation context than lens-to-die separation.
The report tied the failure to de-bonding of the lens material from the bottom of the cup, most likely due to thermal overstress during the wave-solder process.
That makes it a strong library example for showing that visible package-interface separation can be process-driven and functionally meaningful, not just cosmetic.
delamination
de-bonding
thermal-overstress
led-package
Use this when
Best comparison value
- Comparing two different delamination boundaries in LED packages
- Discussing thermally driven package-interface separation
- Teaching that visible de-bonding can be a meaningful process clue
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