A Bent J-Lead Can Masquerade as a Solderability Failure

What the evidence preview establishes

Mechanical damage bent the lead inward toward the package body, shifted its contact point to the extreme rear of the pad, and raised it above the mounting plane. The lead therefore failed to contact the solder deposit even though the materials and reflow process were satisfactory.

Why this case matters

Before diagnosing an isolated unsoldered lead as nonwetting, inspect lead coplanarity and actual pad contact. Normal solder on the pad can coexist with an electrical open when the lead never reaches it.