
Case 897 ยท Public preview
Acceptable Average Gold Can Hide Severe Local Embrittlement
Multiple connector and component solder joints fractured or detached and contained severe voiding and brittle fracture regions.
FractographySEMQuantitative EDSImage analysisPlating-thickness comparison

What the evidence preview establishes
The joints failed because Au-Sn intermetallic platelets segregated at interfaces and void surfaces, creating local gold concentrations above the embrittlement threshold. The platelets also may have obstructed volatile escape during reflow and contributed to severe voiding.
Why this case matters
Bulk gold calculations can miss interface segregation. Examine fracture surfaces and void walls, quantify local Au-Sn phases, and evaluate reflow-controlled platelet morphology before concluding that nominal gold dilution prevents embrittlement.
Full evidence reserved for MEMBER and STOREThe complete case includes the evidence sequence, four interpreted figures, alternative explanations, limitations, and practical application guidance.