Case 2328 ยท Public preview
High-Rate Shock Can Produce Brittle BGA Interfacial Fracture
BGA assemblies separated after an impact event, with most joints failing near the board pads.
Pry testingOptical microscopySEMEDSFractographySample comparison
What the evidence preview establishes
The SAC joints underwent brittle interfacial fracture at or near the tin-nickel intermetallic/electroless-nickel-phosphorus boundary under high-rate shock loading. The assemblies appeared nominal and did not exhibit black-pad characteristics.
Why this case matters
BGA joints that appear strong under slow loading may fail brittlely during shock. Match evaluation strain rate to service loading and consider underfill or a more robust surface finish when impact risk is credible.
Full evidence reserved for MEMBER and STOREThe complete case includes the evidence sequence, four interpreted figures, alternative explanations, limitations, and practical application guidance.