Case 1040 ยท Public preview
Multiple Assembly Defects Can Complicate Intermittent RFID Insert Failures
RFID inserts passed acceptance tests but later failed after additional processing or field exposure.
Electrical testingChemical decapsulationOptical microscopySEMEDSComparative examination
What the evidence preview establishes
No EOS or ESD damage was found. Metallic debris, passivation damage, and large die-attach voids were credible contributors, but destructive die removal prevented a unique causal assignment.
Why this case matters
When an intermittent assembly passes one test and fails another, preserve the bonded interface before destructive die removal. Cross sections, cleanliness controls, nonmetallic handling tools, and passivation inspection can separate ESD suspicion from assembly-induced defects.
Full evidence reserved for MEMBER and STOREThe complete case includes the evidence sequence, four interpreted figures, alternative explanations, limitations, and practical application guidance.