Local Adhesion Comparisons Can Reveal Missing Oxide Treatment on a Copper Thermal Plane

What the evidence preview establishes

The delamination was attributed to a fabrication problem with oxide treatment of the thick copper thermal plane. Most of the separated surface had little or no oxide and poor adhesion, while small regions with appreciable oxide retained the mineral-filled adhesive.

Why this case matters

Evaluate a delaminated copper interface with both sections and its separated surfaces. Small islands of retained adhesive can serve as internal comparisons: correlate their surface treatment and chemistry with surrounding bare areas before assigning the failure solely to the resin or service temperature.