Case 1506 ยท Public preview
Bent Leads and Stamped Solder Can Point to Mechanical Damage after Reflow
Two devices were submitted for solder-joint analysis. Sections showed bent leads, disturbed solder contours, and interfacial separation.
MicrosectioningBSE SEMEDSJoint-to-joint comparison
What the evidence preview establishes
The joint geometry supported mechanical deformation after solder reflow. Bulk chemistry was consistent with tin-copper lead-free solder, without evidence for a contaminant-driven low-melting alloy.
Why this case matters
Read joint shape and lead displacement together with chemistry. When an interface has been mechanically disturbed, evaluate handling after reflow and check whether unusual elemental signals could come from section preparation before alleging solder contamination.
Full evidence reserved for MEMBER and STOREThe complete case includes the evidence sequence, 4 interpreted figures, alternative explanations, limitations, and practical application guidance.