Case 861 ยท Public preview
Mechanical Bending Can Open a Migration Path Between Buried Capacitor Plates
Two board-mounted pi filters developed electrical leakage or shorting and contained cracks extending through their ceramic dielectric.
Optical microscopySEMProgressive microsectioningCrack-path analysisFailed-sample comparison
What the evidence preview establishes
Systematic bending stress cracked the dielectric between opposing capacitor plates, creating a path for silver migration and eventual electrical leakage. A nearby cable connector was a possible source of the bending load.
Why this case matters
Crack position through a brittle component can reveal the loading mode. Surface tension cracks paired with lower-surface compression damage support bending and identify a route by which internal electrodes can migrate and bridge.
Full evidence reserved for MEMBER and STOREThe complete case includes the evidence sequence, four interpreted figures, alternative explanations, limitations, and practical application guidance.