Case 762 ยท Public preview
Package-Molding Flow Can Sweep Bond Wires Into the Die Edge
An ASIC passed system-level acceptance testing and later failed in the field, but bench continuity testing did not reproduce a definite open or short.
Electrical continuity testingForward-voltage comparisonChemical decapsulationBackscattered-electron SEMDie-edge clearance examination
What the evidence preview establishes
Flow stress during package molding swept several bond wires toward the die. Two wires were at or apparently touching the die edge, creating a credible intermittent shorting mechanism for the field failure.
Why this case matters
A device can pass static continuity checks yet fail when package stress moves a swept wire into contact with the die edge. Inspect the complete wire loop and edge clearance after decapsulation, not only the bond interfaces.
Full evidence reserved for MEMBER and STOREThe complete case includes the evidence sequence, four interpreted figures, alternative explanations, limitations, and practical application guidance.