Case 685 ยท Public preview
Package Warpage Can Rupture Bonds Hidden Inside a Molded Oscillator
Two molded BGA oscillator devices failed following thermal testing and contained ruptured internal beam-lead solder bonds.
Optical microscopyProgressive sectioningSEMEDSInternal displacement measurement
What the evidence preview establishes
Thermal warpage during an assembly temperature excursion most likely delaminated the molded body from its PWB substrate and displaced the internal structure enough to rupture soldered beam-lead bonds.
Why this case matters
Section future failures at the assembly level before component removal. In molded packages, correlate internal bond rupture with delamination, displacement, and filler distribution to distinguish service damage from removal artifacts.
Full evidence reserved for MEMBER and STOREThe complete case includes the evidence sequence, four interpreted figures, alternative explanations, limitations, and practical application guidance.