Case 700 ยท Public preview
One Reflow Delamination Mechanism Can Produce Different Device Failures
Two molded semiconductor devices failed after accelerated stress testing and exhibited internal delamination in acoustic images.
Acoustic imaging correlationProgressive microsectioningOptical microscopySEMFailed-to-control comparison
What the evidence preview establishes
Reflow-related molding-compound delamination most likely produced a die crack in one device and enabled bond-pad corrosion in the other.
Why this case matters
Correlate acoustic indications with the eventual physical failure site. The same moisture-and-reflow delamination event can create mechanical die fracture in one device and a corrosion pathway at bond pads in another.
Full evidence reserved for MEMBER and STOREThe complete case includes the evidence sequence, four interpreted figures, alternative explanations, limitations, and practical application guidance.