Internal Plate-Bridging Defects Can Explain MLCC Shorts When External Paths Are Absent

What the evidence preview establishes

Internal dielectric defects, especially a crack bridging opposing plates in one shorted device, best explained the electrical failures. A second shorted device contained a large near-bridging void and suspected knit-line cracks; external residues did not convincingly explain the reported shorts.

Why this case matters

Correlate measured shorts with internal plate-to-plate defects before assigning blame to visible exterior residues. Section more than one failed capacitor, compare controls and construction types, and keep short-producing dielectric defects distinct from termination opens and possible surface leakage.