A Marginal LED Bond Wire Can Reconnect During Sample Preparation

What the evidence preview establishes

The open circuit resulted from a bond-wire fracture immediately above the die bond. Thermal or mechanical tension was the likely applied stress, while off-center wire geometry suggested that original bonding damage may have reduced the fracture margin.

Why this case matters

A continuity change during mounting is evidence, not a reason to dismiss the original symptom. Continue the section until the unstable interface is found, and examine wire alignment for fabrication damage that may amplify later stress.