Case 2428 ยท Public preview
Die-Centered Thermal Evidence Can Explain an Otherwise Subtle Parametric Failure
An integrated circuit exhibited a parametric electrical failure without an obvious external package defect.
Electrical characterizationControlled decapsulationOptical microscopySEMMaterial-location correlation
What the evidence preview establishes
The physical evidence was consistent with excessive die temperature producing internal material degradation and a parametric change rather than an immediate catastrophic open or short.
Why this case matters
A parametric IC failure can preserve continuity while heat changes internal materials or device characteristics. Correlate electrical drift with die-centered residues and coating damage while accounting for decapsulation artifacts.
Full evidence reserved for MEMBER and STOREThe complete case includes the evidence sequence, four interpreted figures, alternative explanations, limitations, and practical application guidance.