Case 2299 ยท Public preview
An Intact Solder Joint Cannot Carry Current Through a Corroded-Away Pad
Two flex-circuit samples were sectioned through subject solder joints and attached traces to investigate reported connection failures.
Targeted microsectioningBSE SEMEDSTwo-sample comparison
What the evidence preview establishes
Both samples showed severe corrosion of copper traces and copper-and-nickel PTH lands. The solder joints themselves remained largely intact, redirecting the failure explanation to loss of the conductors beneath or beside them.
Why this case matters
Section beyond the solder fillet when a flex interconnect fails. A sound solder joint can coexist with a missing pad or trace; inspect both copper and nickel and correlate localized chemistry with the actual conductor-loss path.
Full evidence reserved for MEMBER and STOREThe complete case includes the evidence sequence, 5 interpreted figures, alternative explanations, limitations, and practical application guidance.