Case 2339 ยท Public preview
Encapsulant Separation Can Lift Gold Stitch Bonds from Thick-Film Pads
Encapsulated hybrid assemblies developed open electrical paths after cure or field exposure.
Electrical screeningOptical microscopySEMEDSFTIRMicrosectioningDecapsulation
What the evidence preview establishes
Microsections showed encapsulant separating from the ceramic/thick-film substrate and lifting gold stitch bonds with it. A second mounting method and decapsulation evidence supported the same failure sequence.
Why this case matters
Protective encapsulation can become an applied load. Material selection must account for adhesion, substrate CTE, cure temperature, span, pad surface, and wire dimensions rather than treating encapsulant as mechanically passive.
Full evidence reserved for MEMBER and STOREThe complete case includes the evidence sequence, four interpreted figures, alternative explanations, limitations, and practical application guidance.