
Case 2546 ยท Public preview
Distance from the Neutral Axis Can Expose a Connector CTE-Mismatch Problem
Ceramic PCB assemblies contained reported BGA solder-joint failures beneath connectors with plastic housings.
Metallographic microsectioningSEMEDSSolder microstructure reviewPosition-to-damage comparison

What the evidence preview establishes
The failures were caused by creep rupture driven by CTE mismatch between the plastic connector housing and alumina substrate. Gold embrittlement was not considered a likely factor.
Why this case matters
Compare nominally identical joints at different distances from the neutral axis. A damage gradient concentrated in outer rows is strong evidence of package-to-substrate CTE mismatch and can distinguish design-driven creep from composition-driven embrittlement.
Full evidence reserved for MEMBER and STOREThe complete case includes the evidence sequence, four interpreted figures, alternative explanations, limitations, and practical application guidance.